New leaks on the Web showcased a radical redesign for Apple's next iPhone.

G for Games claimed from a source in China that the tech giant is "experimenting with at least five different iPhone 7 configurations."

No More Lightning Port?

One prototype displayed an iPhone 7 without the Lightning port used in Apple's past smartphones, G for Games wrote. In its place is the company's standard USB Type-C already utilized on new MacBooks. This new connector is compatible with headsets, wireless charging technology, multi-Force Touch, dual camera configurations, and fingerprint recognition technology embedded within the device's display.

Apple Ditching the 3.5mm Headphone Socket?

An iPhone 7 prototype that features wireless charging has fueled rumors that Apple's next mobile device will not have a 3.5mm headphone socket, G for Games added.

9to5 Mac wrote that if the company is planning to have a thinner iPhone 7 than its predecessors, the iPhone 6 and 6s, it makes sense that its headphone socket will be trimmed, probably with a 2.5mm one.

iPhone 7 - More Speculations

Multi-touch technology was already utilized by Apple with its "pinch to zoom" feature in the original iPhone. Now, Forbes reported that the company is allegedly testing integrations of this technology with 3D Touch. This feature, however, could be impractical and confusing for some consumers.

Dual rear camera technology was rumored for the iPhone 6s before its release, but reports alleged that Apple backed out of the plan and chose to develop the feature further for its future devices, Forbes wrote. If this technology shows up in the iPhone 7, it could offer optical zoom instead of the digital zoom in smartphone cameras today.

There are also rumors about an in-display fingerprint recognition. The news outlet noted that this technology would "represent a massive change" for Apple and would allow the company to finally dump the home button and reduce the iPhone's large bezels, making a more pocketable handset.

Forbes added that ditching the home button have two advantages: freeing up front space and keeping the unlock option of the phone accessible. Patents are reportedly issued to Apple for this technology's development.

Note that these are all speculations at the moment and Apple is yet to issue an official announcement.

TSMC to Manufacture Apple's A10 Chip

The Taiwan Semiconductor Manufacturing Company (TSMC) will likely manufacture the A10 processor for Apple's next-generation iPhone.

Apple is rumored to be TSMC's first customer to use its integrated fan-out (InFO) packaging, Apple Insider reported. With the technology, chips can be stacked on top of each other and mounted directly to a circuit board, reducing both the device's thickness and weight.

The iPhone 7 is expected to be released in September 2016.